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Jan 13, 2006
Zoltek Reports Strong Carbon Fibre Growth in 2005
Jan 12, 2006
Unique Polypropylene Antifogger Developed
Jan 12, 2006
Alcoa Flexible Packaging Optimizing Custom Thermoforming Operations in Pharma, Medical Packaging Center of Excellence
Jan 12, 2006
Range Extension of High Performance Fluoropolymer Foams
Jan 12, 2006
Solvay to Boost Ultra Performance Polymer Portfolio with Acquisition of Mississippi Polymer Technologies
Jan 11, 2006
BaySystems becomes an Umbrella Brand for Bayer MaterialScience Polyurethane Systems Houses
Jan 11, 2006
Borealis Reduces Waste with New Transparent, Thin Wall Packaging Solution
Jan 11, 2006
Techmer PM Introduces New Viscosity Modifier
Jan 11, 2006
LANXESS Butyl Rubber Production in Sarnia Cut Back due to Feedstock Supply Problems
Jan 10, 2006
Cereplast Opens Office on the East Coast to Meet Growing Demand for Products
Jan 10, 2006
NOVA Chemicals Introduces New SURPASS® Resin for Blown Film Applications
Jan 10, 2006
Rhodia Polyamide Announces Price Increase for Adipic Acid
Jan 10, 2006
TECHNIP Awarded Contract by Total Petrochemicals for a Demonstration MTO Unit in Belgium
Jan 9, 2006
Licensee Network for DuPont™ Delrin® Decorating Solutions Takes Shape
Jan 9, 2006
Rhodia Polyamide Announces Price Rise for its STABAMID® Polyamide 66 Resins
Jan 9, 2006
Rohm and Haas Company Announces Price Increases for Selected Catalysts and Fine Chemicals in Europe
Jan 6, 2006
Danisco Wins Frost & Sullivan's Excellence in Research Award in the Food Packaging Industry for its Unique Plasticizer - GRINDSTED® Soft-n-Safe
Jan 6, 2006
Distrupol Delivers DSM’s Sarlink® TPV Resin for Tough Audi Under-the-hood Application
Jan 6, 2006
High-impact DuPont™ Zytel® SST Protects Continental’s ESC Sensor Cluster
Jan 6, 2006
Tyco Amp Changes from LCP to Stanyl® High Flow PAA6 for PC Card Healer, Lower Costs and Reduces Warpage
Jan 5, 2006
Engelhard Confirms Receipt of Unsolicited Proposal From BASF
Jan 5, 2006
Plasticolors Introduces Conductive Synergist Technology
Jan 5, 2006
Shepherd Color Announces Black 10P922
Jan 5, 2006
SPC Makes Breakthrough in PTA Packaged Technology
Jan 4, 2006
SPC Leader of Developing Polyester Chip for Industrial Filament

[1...25] [26...50] [51...75] [76...86]
  

Tyco Amp Changes from LCP to Stanyl® High Flow PAA6 for PC Card Healer, Lower Costs and Reduces Warpage


January 06 , 2006

Electronics manufacturer Tyco Amp Den Bosch has changed the material it uses for moulding PCMCIA (PC card) header from liquid crystal polymer (LCP) to Stanyl® polyamide 4,6 (PA46), gaining overall cost savings, better mechanical properties, and very low warpage. Stanyl grade 46HF 5040, a high-flow formulation, easily meets the flow properties of LCP, allowing ready moulding of the tiny features in the header while enhancing much needed mechanical properties.

PC cards are often used in portable and laptop computers to provide plug-in expansion, network connectivity, telecommunications modems, and a host of add-on functions developed over many years. Very low warpage, dimensional stability and high strength are critical to the application, as the slim cards are produced to very high dimensional tolerances and feature locating keys under 1 mm thick.

The header must securely hold 68 pins with a pitch of 0,6mm. a little more than half a millimetre apart and stand up to often rough card insertion practices of portable computer owners. In addition, the heat resistance of Stanyl fits within the production processes of the laptop mainboard, which requires lead free soldering of surface-mount electronic components.

The header design adds complexity in that it incorporates card slots extending several centimetres out from the header itself. Such a design saves assembly labour but adds moulding challenges, made even more challenging by the minuscule dimensions of the moulded features. Model variations include single-card and dual-card headers.

"We worked with Tyco particularly to reduce rejects due to warpage," said Patrick Duis, application development manager, connectors, DSM Engineering Plastics. "Stanyl High Flow enables consistent production of the highly detailed part, and we were able to help Tyco achieve lower per-part cost."

Stanyl High Flow grade 46HF 5040 is one of the Stanyl family of heat-resistant polyamide moulding compounds, produced and marketed exclusively by DSM and available worldwide. Stanyl is used in demanding applications in the automotive and electrical and electronics industries, as well as many other applications. Stanyl is offered in a wide variety of grades including high-flow, abrasion-resistant, and unfilled (non-reinforced), as well as grades containing glass fibres, minerals, lubricants, impact modifiers, or flame retardants.

Higher crystallinity and a faster rate of crystallization give Stanyl a technical edge over such engineering plastics as PA6, PA66, polyesters, and other high heat-resistant resins such as semi-aromatic polyamides (PPAs), PPS and LCPs. Compared to these, Stanyl grades show better heat resistance, mechanical properties at elevated temperatures, wear and friction behaviour and, with faster cycle time and increased flowability, improved processing economics. A dedicated staff of DSM specialists provides technical support in design, moulding, and material selection of Stanyl.

DSM Engineering Plastics

DSM Engineering Plastics is a business group forming part of DSM's Performance Materials cluster. DSM EP is a global supplier of Stanyl PA46 and Akulon® 6 and 66 polyamides, Arnitel® TPE-E, Arnite® PBT and PET polyesters, Xantar® polycarbonate, Yparex® extrudable adhesive resins, and Stamylan® UH Ultra High Molecular Weight PE. These materials are used in technical components for electrical appliances, electronic equipment and cars, in barrier packaging films as well as in many mechanical and extrusion applications. The business group had annual sales of EUR 566 million in 2003. With Stanyl, it is the global market leader in high-heat polyamides.

Source: DSM Engineering Plastics




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